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APPLICATION EXAMPLES
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There are many advantages of laser machining compared to conventional methods such
as EDM, ECM, chemical etching or stamping. Laser can easily cut complex parts with
a high degree of tolerance. The process is programable. Excessively hard, pressure
and force sensitive or very thin materials can be cut with a small focused beam
and a high efficienct use of material. In many cases, laser cutting is prefered
against stamping due to its high flexibility and non-contact characteristic.
Precision welding, especially for hermetic sealing of medical or electronic devices,
requires high weld quality with minimum heat input. Laser welding has been selected
for those applications, providing excellent dimensional control and reliablity.
Our experience in applications, process development, material ablation and melt
ejection, in joint design and metallography makes us a valuable and reliable resource
to the industry.
Following application examples highlight some of our process capabilities,
including:
- Laser micro cutting
and micro drilling of polyimide Kapton, cirlex, rubbers, plastics and woven silks
- Laser cutting of
stainless steels, copper & copper alloys, nickels
and silicon wafers
- Laser cutting of
flexible circuit boards
- Laser precision
welding of aluminium
alloys for hermetic sealing of electronic packages
- Laser transmission welding of
plastics
- Non-contact laser glass cutting and milling
- Laser grooving of microfluidic
channels
- Laser selective polishing of steel surfaces
- Laser selective
hardening of steel alloys
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KJ Laser Micromachining is a leading specialist in micromachining and laser
material processing for both, standard and high-tech applications. We are also a “One Stop
Shop" for all
of your laser related manufacturing needs from process development
to system integration.
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TECHNICAL PAPERS
- "Toward Debris-free Laser Micromachining", application report, Industrial
Laser Solutions, Vol. 23, No.1, p. 16-18, January 2008.
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Abstract:
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The characteristic noncontact and the much-localized heat input from a finely focused
beam have made the laser a perfect choice for machining delicate components that
require high accuracy and precision. Laser micromachining applications such as cutting,
grooving, and drilling are mainly based on material removal via evaporation by high-intensity
pulsed laser irradiation. Until now, the main obstacle in applying this technology
has been debris formation, which is a result of the condensation of supercooled
vapors, partially on the sample surface, partially in the gas phase, via collision
with ambient gaseous molecules. The debris formation deteriorates the feature quality and functionality
of the components. It also reduces ablation effi ciency because debris from the
previous scan can block the laser-beam path for the next scan. Different
techniques were described in this article and are relatively simple to use. To obtain
a high-quality micromachining result, laser users should not focus only on choosing
the appropriate laser or the correct laser parameters. The use of the presented
techniques also should be considered in dealing with debris, recast, burrs, and
thermal damage.
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© 2008 KJ Marketing Services
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